A method of electrolessly gold plating copper on a printed circuit board. The third magnetic film is disposed between the first nonmagnetic film and the second nonmagnetic film, the first magnetic film is disposed between the first antiferromagnetic film and the first nonmagnetic film, and the second magnetic film is disposed between the second antiferromagnetic film and the second nonmagnetic film. Furthermore, the mirror platform may include flexible members disposed near an edge of the mirror platform generally along the axis to isolate the mirror platform and the mirror from warping of the coil frame and twist of the suspension arms to further maintain the relative flatness of the mirror. The apparatus is configured and arranged to rotate the at least one substrate sequentially through the plurality of zones to form a thin film on the substrate.