Disclosed is an improved method and system for implementing metal fill for an integrated circuit design. One or more processes running on the host computing device are identified. The components are suwari-inhibiting components. The search algorithm relies on a genetic algorithms to identify potential optimum electrode configurations within an electrode set. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein. In a preferred embodiment, the notification is by means of a change in a mouse cursor in a graphical user interface.