A package-on-package package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. The apparatus is provided with a collector having an approach connected to the space to be inspected. One or more flexures can interconnect the frame and the stage. An air discharge unit is disposed at the cleaner body through which air which flows from the motor casing of the driving motor is discharged to an outside of the driving chamber.