When a conventional semiconductor container openingclosing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container openingclosing apparatus and adhere to a wafer in the container. Each pedestal changes in cross-section along its length. Further, the manufacturing method comprises deposition under the control of time for the incident angle of ion flow to a substrate to be processed and deposition under the control of time for the ion flow energy to a substrate to be processed. Voltage isolation circuitry transmits data from the parallel data stream between the first microcontroller and the second microcontroller in a serial data stream and provides galvanic isolation between the first microcontroller unit and the second microcontroller unit.