Disclosed are techniques that teach the replacement of the typical organic, plastic, or ceramic package substrate used in semiconductor package devices with a low-CTE package substrate. The network also includes an access point configured to communicatively couple to the utility meter and to the server and configured to notify the server when the utility meter has been bound to the access point. The application is accessible through the user’s web browser and is thus available to authorized users irrespective of physical location. In an embodiment the key silos may comprise an internally lubricated resin.