A method for forming a semiconductor die package is provided. The control portion determines a developer near end when the residual amount of a developer is in a range from a first predetermined amount to a second predetermined amount, and determines a developer end when the residual amount of the developer is equal to or lower than the second predetermined amount. A first mold is disposed between the top electrode and the intermediate electrode, and a second mold is disposed between the bottom electrode and the intermediate electrode. A service provider server receives the video signal from the control section through the Internet for storing the moving picture information corresponding to the received video signal in a database, and provides a home page which assigns a monitoring and management function. An error correction circuit is coupled to the second transconductance amplifier and is configured to generate the second control signal so as to keep constant a voltage on an output of the second transconductance amplifier.