The present invention relates generally to a system and method for including a thin conductive polymer film, such carbon-filled PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. Another object is to provide a manufacturing method of a semiconductor device capable of high speed operation. Tertiary aminoalkylorganometallic compounds can be prepared by reacting selected tertiary haloalkylamines with an alkali metal at a temperature greater than 45 C.