An integrated circuit driver structure, comprising an amplifier, a current mirror block and an external current set resistor, is provided that is digitally configurable to operate in a current output mode or in a voltage output mode with its output level controlled by an external voltage. The method includes receiving a call request at a service provider node, the call request including a called number to reach a called party. The tool is further operable to log movements of the stage. These exposed regions of the leadframe may then be used for soldering the package to a substrate.