Devices, methods, and processes that improve immunity to transient voltages and reduce parasitic impedances. The heating element for heating the image bearing member includes: a substrate having a length corresponding to an entire region of the image bearing member in a longitudinal direction of the image bearing member; and a plurality of resistor chips mounted on the substrate. These sensors may be utilized with in-line systems, closed fluid circuits, bioprocessing systems, or systems which require an aseptic environment while avoiding or reducing cleaning procedures and quality assurance variances. In addition, since a surface area of the protruding portion increases, an amount of heat dissipated from the protruding portion increases. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.