A method for fabricating a semiconductor device includes steps as following. The scan-based integrated circuit contains multiple scan chains, each scan chain comprising multiple scan cells coupled in series. The cartridges preferably snap into the base plate, but may also screw in. The input-side and output-side rectifier-smoother circuits, the inverter and the transformer are enclosed in a casing having a plastic panel. One, or more classification attributes are accessed in response to comparing segments, and the classification attributes are assigned to the packet. A plurality of thin, preferably resin-impregnated, flexible graphite sheets are arranged to form zones in a composite material having a graded density or other characteristic.