A Die Bonder or a Wire Bonder contains a device for holding down a substrate. More particularly, a facsimile manager is provided for managing image files connected with printing, scanning and faxing. The tube cavity has dimension such that the heat transfer surface is in contact with the heat tube. In another aspect, the assembly mounting can incorporate curved damping materials that serve to remove undesirable substrate modes. Suitable hollow body passages include ducts, orifices, lumens, and the like, with exemplary body passages including the coronary arteries.