A cutting insert includes an end cutting edge, a first major cutting edge, and a second major cutting edge. In one embodiment, the method comprises providing a semiconductor substrate comprising an embedded disposable layer, and removing at least a portion of the disposable layer to form a void within the substrate. After a workpiece is processed with the initial parameter configuration, the results are measured and a sensitivity matrix based upon the mathematical model of the processing chamber is used to select new parameters that correct for any deficiencies measured in the processing of the first workpiece.