A semiconductor package and method of producing the same has a semiconductor die having a first face and a second face. The contact clip extends between the first side of at least two semiconductor devices and at least one lead of the leadframe to electrically connect a load electrode of the at least two semiconductor devices to at least one lead. The data packet is encapsulated further in another new header, which is used to specify new VMAN tags. In so doing, the temperature of the filter does not rise excessively, and the filter can be prevented from melting.