Apparatus and methods of controlling call establishment are described. The electroconductive layer and the IC chip are shrouded by a surface protection sheet via a pressure-sensitive adhesive layer. In the turbulence vane a fastening retainer is formed, to which the fastener is fitted. Whether or not an element can be deleted is determined based on a reference counter RC showing whether said element is the component of another element. Lenses are positioned to receive fluorescence from a sample for testing within the transparent chambers and to respectively focus the fluorescence at pin holes in opaque partitions.