A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. In particular embodiments, the intensity of the excitation signals emitted to the localized tissue can be varied in a predetermined manner to generate optical profiling data of the response of the tissue proximate the sensor. Each accommodating space being provided with at least one stopper. Such a multi-layered film including a recording layer also is applicable to a multi-layered recording medium including a first information layer to an N-th information layer disposed on a transparent substrate in this order from a side close to the transparent substrate. The available carrier is designated as a Primary Component Carrier.