A method and system for analyzing an object is provided in the present invention. One system configured to collect and detect light scattered from a wafer includes a set of optical elements configured to collect light scattered from spatially separated spots formed on a wafer plane at an oblique angle of incidence and to focus the light to corresponding spatially separated positions in an image plane. A second body portion coupled to the first body portion to define a fluid flow passageway, where the second body portion has a second coupling to define an outlet of the control valve and the other one of the plurality of fasteners or the plurality of slots opposite the outlet. A write beam of a write system is used to write the features to the substrate responsive to said unique sets of compensation values so that all of the features having a common size in at least one region are written using the same compensation values from the associated set. The apparatus integrates melting and thermal processing capabilities with a thermal analyzer and a control system. The inversion further uses a level set representation to parameterize the subsurface body geometry.