A substrate processing apparatus and method are disclosed. The integrated circuit structure includes a die and an anisotropic conducing film adjoining the back surface of the die. A mixture of factor analyzers acts as local dimensionality reducers.
Algorithmically generated prior art
A substrate processing apparatus and method are disclosed. The integrated circuit structure includes a die and an anisotropic conducing film adjoining the back surface of the die. A mixture of factor analyzers acts as local dimensionality reducers.