A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. The amount of conductive pathway growth, and therefore the programming, depends, in part, on the availability of metal ions. Embodiments may receive one or more e-receipts from the one or more points of transaction; store the one or more e-receipts in the memory; and associate each e-receipt with usage information corresponding to the same transaction. Thus, unlike the conventional method, the present method can minimize error occurring in the residual stress measuring process, and agrees with actual models. The wayside applicator includes an applicator bar that has a dam for holding friction modifying material.