A semiconductor package and a fabrication method thereof are provided in which a chip is mounted on a substrate, and a dielectric layer is applied over the substrate and chip, with bond fingers formed on the substrate and electric contacts formed on the chip being exposed outside. The housing includes a plurality of front interface contacts. The air interface acknowledgement process is: The SFM returns a service flow processing response to the UE; after receiving the response, the UE saves the relevant parameters, and returns an acknowledgement to the SFM. The coupling bracket also includes an extension tab cantilevered from the rear edge of the tubes. Further gratings are then made using a corrected refractive index profile. This invention further relates to a process for manufacturing ultra-concentrated stabilized liquid coffee with enhanced freshness, aroma and flavor retention without acidity or bitterness.