A semiconductor device of which manufacturing steps can be simplified by doping impurities at a time, and a manufacturing method thereof. The process provides for producing a highly uniform product and having a substantially uniform size. The system includes a generator capable of running on the computer. A magnetic sensing element is generally mounted to the compact integrated circuit package. At least one of the metal pads has at least one curved side wall and at least one reference side wall. The recovered molybdenum metal may then be reformed as a target for example by pressing or pressing and sintering, followed by bonding to a target support plate.