The present invention relates to an adhesive composition for a wafer processing film, a wafer processing film, and a semiconductor wafer processing method. As the cage rotates, the guide piece operates to guide the rotation of the cage while removing an excess grease on the raceway surface and transferring the excess grease to axially opposite ends of the outer ring. Control section 104 detects a first operation that is a drag operation performed in a horizontal direction of slide bar 107 based on the touch position detected by display and input control section 102 and a second operation that is performed for slide bar 107, the second operation being different from said first operation. The apparatus includes a plurality of boundary address registers and ISA mode selection logic. A display connected to the ultrasonic processor displays the image of the flaw. At least one treatment station and at least two transfer stations are associated with the transport path, one transfer station acting as a feed station and the other as a removal station for the articles.