A method for etching contactvia openings in low-k dielectric layers is described. In the method according to the present invention, the speed in the fast scan direction is changed with reference to a reference velocity which the printhead is intended to be driven with, while preferably keeping the firing frequency of the sets of nozzles unchanged. The fire stop has a lightweight enclosure that defines an interior space disposed above the suspended ceiling, or behind the wall. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. The core shells are assembled together so as to make the three-dimensional percolated layer, having cavities whose size is around wavelength. According to the invention, the fitting element has a contact surface having the shell structure and the contact surface can be clamped with or is clamped with the shell structure.