A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A first uplink signal and a first downlink signal of a specific band are periodically transmittedreceived within a time-divided section. On the front face side, after resin sealing, the support portion is separated so as to expose front face wiring traces. Methods for use of microfluidic cartridges in a fully automated, pneumatically controlled apparatus are also disclosed. The cam operated shock absorber damper systems may comprise a cylinder and a piston mounted to slide telescopically in the cylinder and a snubber ring comprising rebounding orifices and compression orifices. In other alternatives, the novel method includes transmitting the report to the agency, possibly automatically via an electronic transmission.