A method of processing wafers for saving material and protecting environment is implemented to collect defective or incomplete wafers and perform cutting operation to create a plurality of separate dies. The power supply generates a first high voltage, short duration output across the first and second electrodes during a first time interval to ionize air within the air gap to thereby reduce the high impedance across the air gap to a lower impedance to enable current flow across the air gap at a lower voltage level. Additionally, a sizing function may be applied to the determined principal components before a clustering analysis. Additionally, the system includes a light source configured to generate a light, and an electro-optical modulator configured to receive the light and the driving signal, modulate the light with the driving signal, and generate an optical signal. At least one pair of multi-layered MR elements is arranged in the closed magnetic loop to receive magnetic field substantially perpendicular to a lamination plane of the multi-layered MR elements when no acceleration is applied.