A microelectromechanical system bond release structure is provided for manufacturing of three-dimensional integrated circuit devices with two or more tiers. Examples of charge transport compounds of this invention are those having the following generic formula:n-Ywhere R is an arylamine group;Q comprises an aromatic hydrazone linking group;Y comprises a bridging group between R\u2014Q\u2014groups; and n is an integer between 2 and 6. When V1>Vth, the error amplifier senses an overcurrent condition to provide feedback to the operational amplifier to limit an output current. The guide has a surface that extends along a predetermined conveyance direction for the sheet. A graphical output is configured to display the leak detection value as a function of time.