Providing a noise signal comprises providing a first signal corresponding to a first band of a frequency spectrum of the noise signal. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. Bimatoprost is preferred for this treatment. The retainer includes a radially extending bottom flange at a second end opposite the end wall, wherein the flange bears directly against the cylinder head deck.