1460652882-2e2f31d7-e6dd-425b-8fc8-8dea52bb19a8

An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. Methods of the described technology use data from the sensor package useful to accurately render graphical user interface information on a display. The method may also include transmitting at least one notification to the user recipient during a time window specified by the business entity. The reconstructed waveform can then be conventionally mixed and demodulated to extract useful signal information with enhanced receiver fidelity and sensitivity.