There is provided a new structural composite comprising a web of Z-directionally oriented fibers. An offset layer of the second conductivity type is formed on the semiconductor substrate, and a drain layer of the second conductivity type is formed in a surface region of the offset layer. The shock and vibration absorbing part of the mount is made of elements of molded urethane or similar material that change shape as static loading increases. A particularly effective implementation of this division employs subsequent rounding for real time use. of the manner in which the recipient would like the mail delivered. As a result, the die is detached from the plastic package.