A method and structure are provided for implementing flexible circuits of various electronic packages and circuit applications. A light transmissive substrate is provided. A replaceable member removably attached to the first segment and the second segment. The SIP server transmits a call-out request containing the URI of the first terminal being the call origination source and the URI of a third terminal being the transfer destination, to the first terminal through a network, and the first terminal communicates with the third terminal. 11 wireless LAN is connected via an access point to the latter, and programmed for capturing a plurality of frames data packets traveling to and from the LAN, for performing a detailed protocol analysis on the contents of the headers associated with the captured frames, to detect and diagnose failures or defects in the monitored wireless networks, to permit repair. Thereby, there can be produced a silicon single crystal wafer according to CZ method, which does not belong to any of V region rich in vacancies, OSF region and I region rich in interstitial silicons, and can surely improve electric characteristics such as oxide dielectric breakdown voltage characteristics or the like under stable manufacture conditions.