A method of handling a semiconductor wafer from which a plurality of semiconductor devices are to be fabricated during a semiconductor device fabrication process. An illustrative embodiment of the spiral wiring tubing string includes a tubing core having a tubing interior, an outer tubing layer encircling the tubing core and at least one wiring cable extending through and along the outer tubing layer. The mask-defined solder joints possess a high equilibrium height, which forces the pad-defined solder joints to elongate, thereby making the pad-defined solder joints more compliant.