A method for forming a semiconductor structure includes forming a first contact pad on a first die, wherein the first contact pad comprises a first metal element, forming a metal over the first contact pad, wherein the metal comprises a second metal element, and the second metal element is different from the first metal element. Selection data representative of multiple electronic documents encoded in multiple disparate formats is first received. The resultant blend can be biaxially stretch-oriented to produce a single-layered polymer-based sausage casing suitable for use with uncooked sausage meats such as chorizo, and specifically suitable for the gas and moisture permeability needed during the curing process for uncooked sausage meats. After the wires of the cable are soldered to the terminals of the connector, the first fastening members are brought downward along interior surfaces of the housing recess to engage the first latch openings, with the other fastening member simultaneously engaging the second latch opening to join the cover plate to the housing. The base is configured to detect at least one characteristic related to the reusable component when the reusable component is placed into the at least one slot. The second pixel may be readout in the same manner.