A method of fabricating a substrate with an embedded component therein including the following steps is provided. The interconnect structure includes a semiconductor substrate; a dielectric layer over the semiconductor substrate; a metallic wiring in the dielectric layer; a pre-layer over the metallic wiring, wherein the pre-layer contains boron; and a metal cap over the pre-layer, wherein the metal cap contains tungsten, and wherein the pre-layer and the metal cap are formed of different materials. The multiple aggregation devices can be separate switches, and the LAG can include multiple ports across the switches, with a different identifier being assigned to each of the ports in the LAG. The fluid outlets direct the cooling fluid directly onto the web. By use of this method, encrypted software is resistant to copying from RAM in a decrypted state for subsequent reverse engineering. A thermopile sensor is also provided, and a calorimetric gas sensor implementing the thermopile sensor is provided.