Techniques, apparatus and systems are described for wafer-scale processing of aligned nanotube devices and integrated circuits. On a substrate, a pad oxide layer and a mask layer are successively formed. A current sink transistor is coupled from the output of the dual-mode charge pump to a ground reference through a current sink control switch transistor that is turned on by the optional pull down control signal. A first solder region bonds the top package to the conductive pipe, wherein the first solder region extends into a region encircled by the conductive pipe. It is connected by standard audio-visual coaxial cable to the TV and associated video devices and sends compressed digital video signal information to the video remote control by RF communication. The upper chip is flip-chip bonded to the upper surface of the substrate; and the lower chip is accommodated in the opening and wire-bonded to the upper chip.