An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The encapsulated insulation is fastened to the bottom of the square support tubes with corrosion-free nylon anchors which allows the soft insulation assembly to span over the water and rest directly on the spa bartop surface sealing the heat in and keeping debris out. The first layer is provided to be closer to the first electrode than the second layer, and the third layer is provided to be closer to the second electrode than the second layer. The plurality of fuel lines deliver fuel to the plurality of fuel nozzles via the plurality of fuel line passages. The tray is disposed in the chassis in an extractable manner.