A system for wafer handling employing a complex numerical method for calculating a path of wafer travel that controls wafer acceleration and jerk, and results in maximum safe speed of wafer movement from a first point to a second point. The bend can be formed by securing a portion of the optical fiber in a fixture and laterally displacing a portion of the fiber outside the fixture using a depressor. The software design specification may be scanned and code may be generated for implementing the software system based on information obtained from scanning the software design specification. The support member has a folded position and an extended position where the support member is unfolded.