A wafer level package for a MEMS device is made by bonding a MEMS wafer and a lid wafer together to form a hermetically sealed cavity. The control information extraction unit generates a frame that contains at least a plurality of slots in such a manner as to synchronize with the frame corresponding to the received information. Preferably, the provider owns or otherwise manages the provisioned environment, which can be augmented as needed to meet the debugging requirements of the particular issue.