A Ni alloy layer is formed on a surface of a steel base on the side to be in direct contact with a molten aluminum alloy, and titanium carbide is bonded in a particulate state to the surface of the Ni alloy layer. The semiconductor package includes a trace substrate, a chip and a plurality of wires. A checklist corresponding to the set of acquired merchants is retrieved. The system may also include an instrument that is capable to measure a wind speed and a wind direction. The threshold may be programmable.