A data processing circuitry includes a data input, a data output and a processing path arranged between the data input and the data output. Fine pitch solder bumps, consisting of pillar metal and a solder bump, are applied directly to the IO pads of the semiconductor device, the device is then flip-chip bonded to a substrate. An organic chemical conversion film is subsequently formed on the inorganic chemical conversion film by an organic chemical conversion treatment. Whereby, the workman can visually see and easily manipulate the sprinkler headvalve assembly between the on and off position.