A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. The method according to one embodiment includes transmitting information related to a number of HARQ processes between the BS and a relay node to the RN. Each of the holders has a circular bottom wall, a cylindrical sidewall, and a plurality of partition plates placed in the space defined by the bottom wall and the sidewall such that the partition plates are spaced apart at predetermined circumferential intervals and form reception cells. A detected signal of the signal management control unit 47n is an AC-transforming clock FR applied to a terminal CKBn. For example, a method may include receiving web page identification data that is derived from user clickstream data, determining a URL associated with a domain based on the webpage identification information, and providing a measurement code verification web crawler with the URL and the depth to which to explore the domain for verifying measurement code placement with the web crawler. Other embodiments provide an organic light-emitting diode device comprising a compound of Formula I.