Using side-wall conductor leads insulated by side-wall insulators to form package level conductor leads for active circuits manufactured on silicon substrate, the preferred embodiments of the present invention significantly reduces the areas of surface mount package chips. A dummy die is disposed onto the substrate corresponding to the opening so as to form a composite chip carrier with a chip cavity. The generic protocol allows a gateway to request contexts or session information and send information that allows tunnel setup and mapping to other connections. Molecule relaxation, reorientation and rotation also can be determined using a microscope combined with a spectroscopic device.