A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0. The process provides nano-crystals with a mean hydrodynamic diameter of less than 1 micron, particularly less than 300 nm and is particularly useful for the preparation of nano-crystalline dispersions of pharmaceutical substances. The second vane assembly member includes a second segment of the inner band including a second edge of shape and size matched with the first edge and extending through the inner band circumferential edge portions.