To provide a semiconductor device including an interface chip and a core chip and a measurement-target signal line and a reference signal line each including a through silicon via provided in the core chip and electrically connecting the interface chip and the core chip. Pixel regions and a peripheral driver circuit are integrally packed on the display. This provision makes it possible to increase the operating speed of power looms. In the opening position, the apron is folded onto itself in the upper part of the guide rails, whereby this upper part is horizontal or inclined relative to the horizontal.