A flip-chip package may include: a semiconductor chip having first pads arranged substantially along a first direction; a substrate having second pads, arranged substantially in a zigzag form aligned with the first pads as a center line, and facing the semiconductor chip; and conductive bumps for electrically connecting the first pads to the second pads in a one-to-one relationship. A mobile unit consumes power in standby mode by periodically scanning the base station in each neighboring cell to determine which base stations are providing a usable signal. The invention also relates to a corresponding method for selecting a shape of such a cathode. A second of the openings providing access to a tobacco receptacle extending into the base from the second opening. In accordance with the above image processing, translucent polygons can be sequentially processed from the front, so rendering processing of important polygons positioned at the front in a display screen is not omitted, even if the time between frames is short. In so doing, the method and apparatus prevent lost audio.