A semiconductor process is taught for performing electroless plating of copper overlying at least a portion of a layer comprising cobalt, nickel, or both cobalt and nickel. As greater demands are placed on RF systems, for example in WLAN’s in order to increase channel capacity by utilizing available bandwidth, corresponding demands are placed upon performance and tolerance of components used in FR circuits. The credit card is inserted within the assembly for processing and once approved, the PC card may be removed. The present invention enables sample preparation and handling for diagnostic assays and biochemical analysis in an array format, and the functional integration of these operations.