A method of manufacturing a pressure sensor is provided whereby the pressure sensor includes a joint, a diaphragm, and an adapter disposed between the joint and the diaphragm. The input values, coefficients, and output values of the arrangement can be stored in the memory area and called up again therefrom as needed. Aligning the vented portion of the inner wrapper and the vented portion of the outer wrapper so that they do not overlap restricts the transfer of air and moisture through the packaging system. The buffer circuit includes a charging capacitor, a first NPN transistor and a second PNP transistor.