The present invention relates to \u201cgrafting to\u201d methods of modifying materials surfaces with high-density polymer brushes. Then, the current listening device transmits information associated with the beacon to the group of electronic devices using a second communication protocol, which is different than the WLAN communication protocol and has a lower power consumption. The semiconductor assembly and method may further have a plurality of raised areas on the leadframe which are used for wirebonds. The column leg has an outside formed with an annular wall and an inside formed with a trigger point. The excision portion is formed of the non-insulated portion of the cutting wire.