A platform for and method of computer processing to support processor failover are disclosed. The local user server records all user actions and gestures. According to the present invention, the plurality of sets of the packages and caps held in batch by the multi-clip are heated and sealed, therefore the sealing efficiency of the packages and caps can be improved. Also, such methods and circuits can eliminate the need for a low noise amplifier in a receiver or transceiver subsystem. In addition, the method for producing an amide-based polymer of the present invention is characterized by homopolymerizing the amide compound or by copolymerizing the amide compound and at least unsaturated monomer copolymerizable with the amide compound.