In a semiconductor integrated circuit device, upon connection of an interconnection made of aluminum or aluminum alloy and another interconnection made of Cu or Cu alloy, a barrier conductor film or plug is disposed at the joint portion between these interconnections. In certain example embodiments, graphene thin films grown on large areas hetero-epitaxially, e. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The second optical surface is a series of annular concentric rings. The invention has particular application to \u201cOptic\u201d devices for dispensing carbonated spirit drinks.