The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. When the portion of the copper layer is removed by etching, undercutting of the titanium layer is avoided since the titanium layer is covered by the dielectric layer, thereby providing an improved support for the conductive pillar to increase product reliability. The selector circuit includes: a first input terminal and a second input terminal which are connected to the output terminal of the second D-type flip-flop and an output terminal of the third D-type flip-flop, respectively; and a select terminal connected to an output terminal of the XOR circuit.