The present invention provides a method for preventing the defect the in shape of via holes cased when an alumina mask is used for the dry etching of an interlayer insulator composed of an SiOC film in the dual damascene process in which via holes are formed prior to forming wiring trenches. The pulsating force on the drive rod drives the first fixing element into the predefined seat in the work piece. Access to the access-protected data by the monitoring ensues exclusively via an authorization unit associated with the system to be serviced.